물리적 안티탬퍼 인클로저 및 마이크로초 제로화 시스템

다층 물리적 차단 인클로저, 능동 연속 정전용량 메시 및 배터리 구동 독립 제로화 스위치를 엔지니어링하여 미세한 물리적 침해 시에도 암호화 키를 즉각 파괴합니다.

HSMProtect Physical Security Enclosure Architecture

Cryptographic Enclave: Physical Security Enclave — FIPS 140-3 L4 Physical Barrier

Hardware Security Nodes & Co-Processors

  • Active Serpentine Sensor Mesh
  • Environmental Threat Detector
  • Microsecond Crowbar Zeroization Switch
  • Autonomous Battery Backup Controller
  • Opaque Potting Compound Barrier

Architectural Layers & Silicon Defenses

  • Layer 1: Exterior Enclosure & Opaque Potting Barrier (Aerospace Aluminium / Chemically-Inert Resin): Preventing optical inspection, X-ray scanning, and non-destructive disassembly of the internal electronics.
  • Layer 2: Multi-Layer Active Serpentine Sensor Mesh (Sub-50 Micron Continuous Conductive Traces): Continuously transmitting high-frequency pseudo-random signals; any break, short-circuit, or capacitance shift triggers zeroization.
  • Layer 3: Autonomous Environmental Guard Sensors (MEMS Pressure / Optical Photodiodes / Thermal): Detecting cryogenic freezing attacks (< -40°C), thermal baking (> +105°C), vacuum depressurization, and decapsulation.
  • Layer 4: Hardware Zeroization Actuator & BBRAM Bus (Ultra-Fast MOSFET Crowbar / Zero-Power Erase): Discharging Battery-Backed RAM (BBRAM) and physically severing key storage rails in under 10 nanoseconds.

Cryptographic Telemetry & Compliance: < 10 ns (Physical Zeroization Response) | 100% (Drill & Milling Detection) | -40°C to +105°C (Operational Temperature Envelope) | > 10 Years (Autonomous Battery Guard Life)

암호엔클레이브를 위한 무관용 물리적 보안

When adversaries gain physical possession of a cryptographic device, conventional software security ceases to be effective. HSMProtect establishes impenetrable physical barriers, encasing sensitive cryptographic silicon in continuous active sensing meshes and potting compounds that trigger irreversible microsecond key zeroization upon drilling, milling, chemical etching, or temperature extremes.

Core Engineering Areas

Technical Publications

Related Cluster Architecture Specifications